Resilient and agile engineering solutions to address societal challenges such as coronavirus pandemic
Resilient and agile engineering solutions to address societal challenges such as coronavirus pandemic
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DOI：
10.1016/j.mtchem.2020.100300
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发表时间：
2020-09-01
影响因子：
7.3
通讯作者：
Barber, Asa H.
中科院分区：
文献类型：
--
作者：
Goel, Saurav;Hawi, Sara;Barber, Asa H.
世界正经历动荡时期，美国、英国、俄罗斯、印度和欧洲大部分地区等主要经济大国继续处于封锁状态。由于此次封锁，受打击最严重的行业是销售、生产（制造业）、运输（航空航天和汽车）和旅游业。作为避免传染性和传染性“2019 年冠状病毒病”(COVID-19) 传播的预防措施，封锁成为必要。这种新发现的疾病是由一种新病毒株引起的，被称为严重急性呼吸综合征冠状病毒 2（SARS CoV-2；以前称为 2019-nCoV）。我们回顾了当前针对 COVID-19 的医疗和制造应对措施，包括仪器、传感、激光使用、熏蒸室的进展以及新型工具的开发，例如使用组合增材和减材制造技术的芯片实验室以及在药物和疫苗发现中使用分子建模和分子对接。我们还就气候变化、外包与本土制造、自动化和抗菌素耐药性等未来考虑因素提供观点。总体而言，本文试图确定可以利用制造业来应对 COVID-19 等社会挑战的关键领域。 (c) 2020 作者。由爱思唯尔有限公司出版
The world is witnessing tumultuous times as major economic powers including the US, UK, Russia, India, and most of Europe continue to be in a state of lockdown. The worst-hit sectors due to this lockdown are sales, production (manufacturing), transport (aerospace and automotive) and tourism. Lockdowns became necessary as a preventive measure to avoid the spread of the contagious and infectious "Coronavirus Disease 2019" (COVID-19). This newly identified disease is caused by a new strain of the virus being referred to as Severe Acute Respiratory Syndrome CoronaVirus 2 (SARS CoV-2; formerly called 2019-nCoV). We review the current medical and manufacturing response to COVID-19, including advances in instrumentation, sensing, use of lasers, fumigation chambers and development of novel tools such as lab-on-the-chip using combinatorial additive and subtractive manufacturing techniques and use of molecular modelling and molecular docking in drug and vaccine discovery. We also offer perspectives on future considerations on climate change, outsourced versus indigenous manufacturing, automation, and antimicrobial resistance. Overall, this paper attempts to identify key areas where manufacturing can be employed to address societal challenges such as COVID-19. (c) 2020 The Authors. Published by Elsevier Ltd.