Stereolithography on silicon for microfluidics and microsensor packaging
Stereolithography on silicon for microfluidics and microsensor packaging
复制标题
用于微流体和微传感器封装的硅立体光刻技术
DOI：
10.1007/s00542-002-0254-y
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发表时间：
2003
期刊：
影响因子：
--
通讯作者：
J. Gole
中科院分区：
文献类型：
--
作者：
L. A. Tse;P. Hesketh;D. Rosen;J. Gole
光固化快速成形技术可以用于制造三维和高深宽比的微结构，并且制造成本低，制造时间短。立体光刻可以定制用于微流体和微传感器的封装，以消除反应室的死体积。在晶片级规模上制造MEMS封装可以减少制造时间和组装时间。为了显示立体光刻与微机械器件集成的可行性，已经研究了对准、清洁和切割测试。立体光刻应用于化学传感器，叉指电极，和AFM悬臂流体电池包。清洁过程后，对器械进行了测试，并通过了功能测试。
Stereolithography can be used to fabricate 3-D and high aspect ratio microstructures with low manufacturing cost and short fabrication time. Stereo lithography can customize the packages for microfluidics and microsensors to eliminate the dead volume of the reaction chamber. Fabrication of MEMS packages on a wafer level scale can decrease the manufacturing time and assembly time. In order to show the feasibility of integration of stereolithography with micromachined devices, alignment, cleaning, and dicing tests have been investigated. Stereolithography was applied to chemical sensors, interdigitated electrodes, and an AFM cantilever fluid cell package. After the cleaning process the devices were tested and passed a functional test.