Design and Application of Imaging Plasma Instruments

Design and Application of Imaging Plasma Instruments
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等离子体成像仪器的设计与应用

DOI:
10.1029/gm102p0125
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发表时间:
2013
期刊:
Geophysical monograph
影响因子:
--
通讯作者:
J. Mcfadden
J. Mcfadden
中科院分区:
--
文献类型:
--
作者:
C. Carlson;J. Mcfadden

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基于圆柱对称顶帽分析光学器件的成像粒子探测器用于许多当前一代航天器的等离子体仪器,包括 Wind、Cluster、Fast、Mars Observer、Mars Global Surveyor、Lunar Prospector 和众多探空火箭。这些仪器旨在提供具有良好相空间分辨率的颗粒分布函数的快速测量。可以优化设计细节以测量特定的等离子体群,例如冷束、热分布或损耗锥特征。顶帽几何形状是传统球形截面静电分析仪光学器件的简单扩展,但有几个相互作用的设计参数不是唯一确定的。对于几何因子、能量分辨率和角度接受度的指定值,可以使用解析表达式来指定初步的机械尺寸。然后通过计算机轨迹跟踪程序对该初始设计进行优化,该程序考虑了其他设计细节,例如输入孔径准直和粒子探测器位置,或其他光学元件,例如输入偏转器或飞行时间探测器。一旦指定了光学设计,就可以解决其他设计考虑因素,例如粒子检测方法、紫外线和电子散射的抑制、污染控制、电气接口和一般机械封装。描述了几种当前飞行仪器的示例。
Imaging particle detectors based on the cylindrically symmetric top hat analyzer optics are used in plasma instruments for many of the current generation of spacecraft, including Wind, Cluster, Fast, Mars Observer, Mars Global Surveyor, Lunar Prospector, and numerous sounding rockets. These instruments are designed to provide rapid measurements of particle distribution functions with good phase space resolution. Design details can be optimized for measuring specific plasma populations, such a cold beams, hot distributions, or loss cone features. The top hat geometry is a simple extension of traditional spherical section electrostatic analyzer optics, but there are several interacting design parameters that are not uniquely determined. For specified values of geometric factor, energy resolution and angular acceptance, analytic expressions can be used to specify preliminary mechanical dimensions. This initial design is then optimized by a computer trajectory-tracing program that accounts for additional design details such as input aperture collimation and particle detector location, or other optical elements such as input deflectors or time-of-flight detectors. Once the optical design is specified, additional design considerations are addressed, such as the particle detection method, suppression of UV and electron scattering, contamination control, electrical interfacing, and general mechanical packaging. Examples of several current flight instruments are described.
DOI: --
发表时间: 2002
期刊: Proceedings of International Symposium on Dry Processes 2002
影响因子: --
作者:
R.Imai;A.Nakajo;H.Hiramatsu;T.Nishimori;T.Kasuya;M.Wada
通讯作者: M.Wada