Design and optimization of wafer bonding packaged microelectromechanical systems thermoelectric power generators with heat dissipation path
Design and optimization of wafer bonding packaged microelectromechanical systems thermoelectric power generators with heat dissipation path
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DOI：
10.1116/1.3046155
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发表时间：
2009-05-01
影响因子：
1.4
通讯作者：
Xie, Jin
中科院分区：
文献类型：
--
作者：
Lee, Chengkuo;Xie, Jin
研究了一种新型的具有独特散热路径的基于微电子机械系统的温差发电器。利用基于焊料的晶片键合技术，作者可以将三片晶片键合成真空封装的TPG。根据有限元方法和解析建模结果，在热电偶结两端温差约为6℃时，器件的单位面积输出功率为68.6微瓦/厘米(2)。结果表明，所提出的器件概念是一种有效且低成本的提高输出电压的方法。
A new concept of microelectromechanical system based thermoelectric power generator (TPG) with unique heat dissipation path is investigated in this study. By using solder based wafer bonding technology, the authors can bond three pieces of wafers to form vacuum packaged TPG. According to the finite element method and analytical modeling results, the output power per area of device is derived as 68.6 mu W/cm(2) for temperature difference of about 6 degrees C between two ends of thermocouple junctions. It shows that the proposed device concept is an effective and low cost approach to enhance the output voltage.