The Influence of Polymerization Shrinkage of Resin Cements on Bonding to Metal
The Influence of Polymerization Shrinkage of Resin Cements on Bonding to Metal
复制标题
树脂水泥聚合收缩对金属粘结的影响
DOI：
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发表时间：
1992
期刊：
影响因子：
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通讯作者：
C. Davidson
中科院分区：
文献类型：
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作者：
C. Verzijden;A.J. Feilzeri;N. Creugers;C. Davidson
在用作树脂粘结桥和牙齿结构之间的粘结剂的树脂复合物粘固剂（RCC）的凝固期间，粘结可能由于收缩应力的发展而被破坏。本研究的目的是调查的收缩应力的影响，三种不同的碾压混凝土的粘合剂和凝聚力的质量时，粘结到金属表面在一个刚性的设置。将两个相对的平行NiCr盘（Wiron 77）以200微米的相互距离安装在张力计中，并用Panavia Ex、Clearfil F2或Microfill Pontic C粘结。通过电解蚀刻、喷砂、硅烷涂层或镀锡对合金表面进行处理。在设置过程中，盘保持在其原始的相互距离，以模拟“完全”刚性的极端临床情况，其中铸件和牙齿不能朝向彼此移动。连续记录发展的收缩应力。在固化过程中，RCC与硅烷涂层表面的粘合强度始终高于其早期内聚强度。电解蚀刻表面以及喷砂表面显示，在几乎所有的情况下，粘合剂失效。镀锡样品主要表现为金属/树脂界面处的粘合失效。硅烷涂层表面与Clearfil F2结合使用时，粘合强度值最高。
During the setting of a resin composite cement (RCC) used as an adhesive between a resin-bonded bridge and tooth structure, the adhesion may be disrupted by the development of shrinkage stress. The aim of this study was to investigate the influence of the shrinkage stress of three different RCCs on their adhesive and cohesive qualities when bonded to metal surfaces in a rigid set-up. Two opposing parallel NiCr discs (Wiron 77) were mounted in a tensilometer at a mutual distance of 200 microns and cemented with Panavia Ex, Clearfil F2, or Microfill Pontic C. The alloy surfaces were treated by either electrolytic etching, sand-blasting, silane-coating, or tin-plating. During setting, the discs were kept at their original mutual distance to simulate the extreme clinical situation of "complete" rigidity, where the casting and the tooth cannot move toward each other. The developing shrinkage stress was recorded continuously. During setting, the adhesive strength of the RCCs to silane-coated surfaces was always higher than their early cohesive strength. Electrolytically-etched surfaces as well as sand-blasted surfaces showed, in almost all cases, adhesive failure. The tin-plated samples showed mainly adhesive failure at the metal/resin interface. The highest bond strength values were found for silane-coated surfaces in combination with Clearfil F2.