On the fracture behaviour of CFRP bonded joints under mode I loading: Effect of supporting carrier and interface contamination
On the fracture behaviour of CFRP bonded joints under mode I loading: Effect of supporting carrier and interface contamination
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DOI：
10.1016/j.compscitech.2018.03.024
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发表时间：
2018-05-26
影响因子：
9.1
通讯作者：
Budzik, Michal K.
中科院分区：
文献类型：
--
作者：
Heide-Jorgensen, Simon;de Freitas, Sofia Teixeira;Budzik, Michal K.
本文研究了具有沿裂纹扩展路径的接吻粘结的复合板的断裂行为。为获得双悬臂梁在位移控制加载条件下的响应，进行了双悬臂梁试验。实验数据被收集并对有和没有接吻键的试件进行了分析。观察和讨论了粘结剂载膜的影响、裂纹的非光滑扩展和R曲线的上升。提出了一个考虑上述影响的分析模型。接吻粘结导致裂纹的不稳定扩展，导致承载能力的丧失。胶膜中编织载体的存在导致了粘滑现象所特有的裂纹扩展过程，并通过引发桥联现象显着增加了粘合线的抗断裂能力。该模型与实验数据吻合较好。对断裂过程有了良好的了解，从而能够分析和预测接吻键和支承载体的影响。(C)2018爱思唯尔有限公司。保留所有权利。
This paper addresses the fracture behaviour of bonded composite plates featuring a kissing bond along the crack growth path. Double cantilever beam (DCB) experiments are carried out under a displacement controlled loading condition to acquire the load response. The experimental data are collected and analysed analytically for specimens with and without kissing bond. The following aspects are observed and discussed: effect of the adhesive carrier film, non-smooth crack growth and rising R curve. An analytical model taking into account the aforementioned effects is proposed. The kissing bond leads to unstable crack growth resulting in a loss of the load carrying capacity. The presence of the knit carrier in the adhesive film results in the crack growth process characteristic for the stick-slip phenomena and a significant increase of the resistance to fracture of the bondline by triggering a bridging phenomenon. The model shows a very good agreement with the experimental data. A sound understanding of the fracture process is gained enabling analysis and prediction of the effects of kissing bonds and supporting carrier. (C) 2018 Elsevier Ltd. All rights reserved.