Soft nanocomposite electroadhesives for digital micro- and nanotransfer printing
Soft nanocomposite electroadhesives for digital micro- and nanotransfer printing
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DOI：
10.1126/sciadv.aax4790
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发表时间：
2019-10-01
期刊：
影响因子：
13.6
通讯作者：
Hart, A. John
中科院分区：
文献类型：
--
作者：
Kim, Sanha;Jiang, Yijie;Hart, A. John
微尺度物体的自动处理对于制造下一代电子系统是必不可少的。然而，机械拾取和放置技术无法操纵表面力超过重力的较小物体，新兴的微转移印刷方法需要多方向运动、加热和/或化学粘合来切换粘合。我们介绍了软纳米复合电粘剂(SNES)，它由稀疏的介电涂覆碳纳米管(CNT)森林组成，具有静电可切换的干粘附性。SNES的标称干附着力比典型固体低40倍，但通过在碳纳米管上施加30V电压，它们的附着力提高了100倍。我们用表面形貌、介质厚度和外加电压来表征附着力的缩放，并演示了银纳米线、聚合物和金属微粒以及未封装的发光二极管薄膜的数字转移印刷。
Automated handling of microscale objects is essential for manufacturing of next-generation electronic systems. Yet, mechanical pick-and-place technologies cannot manipulate smaller objects whose surface forces dominate over gravity, and emerging microtransfer printing methods require multidirectional motion, heating, and/or chemical bonding to switch adhesion. We introduce soft nanocomposite electroadhesives (SNEs), comprising sparse forests of dielectric-coated carbon nanotubes (CNTs), which have electrostatically switchable dry adhesion. SNEs exhibit 40-fold lower nominal dry adhesion than typical solids, yet their adhesion is increased >100-fold by applying 30 V to the CNTs. We characterize the scaling of adhesion with surface morphology, dielectric thickness, and applied voltage and demonstrate digital transfer printing of films of Ag nanowires, polymer and metal microparticles, and unpackaged light-emitting diodes.