Lifetime Prediction for Power Electronics Module Substrate Mount-down Solder Interconnect
Lifetime Prediction for Power Electronics Module Substrate Mount-down Solder Interconnect
复制标题
电力电子模块基板安装式焊接互连的寿命预测
DOI：
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发表时间：
2007
期刊：
影响因子：
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通讯作者：
David.R. Newcombe
中科院分区：
文献类型：
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作者：
Hua Lu;T. Tilford;Chris Bailey;David.R. Newcombe
提出了一种预测大面积焊点在热机械循环载荷作用下寿命的数值模拟方法。该方法基于Miner线性损伤累积准则和大面积焊点裂纹前累积塑性应变的性质。考虑了焊点损伤指标的非线性分布。该方法已被用来计算在铁路牵引控制应用中发现的混合循环载荷条件下的电源模块中的焊料互连的寿命。结果表明，焊料厚度是一个参数，有很强的影响的损伤，因此焊点的寿命，而基板的宽度和基板的厚度是不太重要的寿命。
A numerical modeling method for the prediction of the lifetime of solder joints of relatively large solder area under cyclic thermal-mechanical loading conditions has been developed. The method is based on the Miner's linear damage accumulation rule and the properties of the accumulated plastic strain in front of the crack in large area solder joint. The nonlinear distribution of the damage indicator in the solder joints have been taken into account. The method has been used to calculate the lifetime of the solder interconnect in a power module under mixed cyclic loading conditions found in railway traction control applications. The results show that the solder thickness is a parameter that has a strong influence on the damage and therefore the lifetime of the solder joint while the substrate width and the thickness of the baseplate are much less important for the lifetime.