Optimization of HNO3 leaching of copper from old AMD Athlon processors using response surface methodology.
Optimization of HNO3 leaching of copper from old AMD Athlon processors using response surface methodology.
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DOI：
10.1016/j.jenvman.2018.01.026
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发表时间：
2018-04
影响因子：
8.7
通讯作者：
U. Javed;R. Farooq;Farrukh Shehzad;Zakir Khan
中科院分区：
文献类型：
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作者：
U. Javed;R. Farooq;Farrukh Shehzad;Zakir Khan
研究了硝酸浓度(%)、温度(°C)和超声波功率(W)对AMD Athlon旧处理机中硝酸浸出铜的影响。采用中心复合旋转设计(CCRD)的响应面方法进行优化研究。方差分析的结论是，基于p值(0.003)、r2(0.97)和adj-r2(0.914)的15次实验运行，二次多项式模型非常适合。研究表明，温度对铜的浸出浓度影响最大，其次是硝酸浓度。而超声波功率对浸出浓度无显著影响。结果表明，当硝酸浓度为20%、温度为48.89℃、超声功率为5.52W时，浸出铜的最大浓度为97.916 mg/L。
The present study investigates the optimization of HNO3leaching of Cu from old AMD Athlon processors under the effect of nitric acid concentration (%), temperature (°C) and ultrasonic power (W). The optimization study is carried out using response surface methodology with central composite rotatable design (CCRD). The ANOVA study concludes that the second degree polynomial model is fitted well to the fifteen experimental runs based on p-value (0.003), R2(0.97) and Adj-R2(0.914). The study shows that the temperature is the most significant process variable to the leaching concentration of Cu followed by nitric acid concentration. However, ultrasound power shows no significant impact on the leaching concentration. The optimum conditions were found to be 20% nitric acid concentration, 48.89 °C temperature and 5.52 W ultrasound power for attaining maximum concentration of 97.916 mg/l for Cu leaching in solution.