High Q-Factor PCB Embedded Flip-Chip Inductors With Multilayer CZTB Magnetic Sheet for Power Supply in Package (PwrSiP)
High Q-Factor PCB Embedded Flip-Chip Inductors With Multilayer CZTB Magnetic Sheet for Power Supply in Package (PwrSiP)
复制标题
用于封装电源 (PwrSiP) 的具有多层 CZTB 磁片的高 Q 因数 PCB 嵌入式倒装芯片电感器
DOI：
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发表时间：
2021
影响因子：
5.5
通讯作者：
P. McCloskey
中科院分区：
文献类型：
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作者：
D. Jordan;G. Wei;Liang Ye;D. Lordan;P. Podder;A. Masood;K. Rodgers;C. Mathuna;P. McCloskey
本文研究了一种新的方法来集成多层，薄膜磁性嵌入印刷电路板（PCB）的电源在一个封装（PwrSip）的应用。螺线管电感器结构是通过将多层CZTB磁性片夹在两个不同的PCB之间形成的，每个PCB上都有铜线，形成了器件的上下绕组。利用安装在其中一个PCB的暴露NiAu焊盘上的焊球的焊料回流工艺用于在两个板之间创建电连接，因此，形成电感器的绕组的闭合电流回路。这种新颖的电感器结构使得能够使用约4盎司（<inline-formula><tex-math notation="LaTeX">140 μ ext{m}$</tex-math></inline-formula>）的铜来封装多层CZTB磁性片，并且因此展示了非常低<inline-formula>的<tex-math notation="LaTeX">$R_{ ext {dc}}$</tex-math></inline-formula>。多层CZTB磁性片的特征在于使用Ryowa磁导率。磁性片表现出367的磁导率。利用矢量网络分析仪（VNA）对所制作的倒装芯片电感进行了电特性分析。该器件的占地面积为7.25 mm<sup>2</sup>，电感为52 nH。制作的PCB嵌入式电感器在40 MHz时的峰值品质因数达到23。
This article investigates a novel approach to the integration of multilayer, thin film magnetics embedded in printed circuit board (PCB) for Power Supply in a Package (PwrSip) applications. A solenoid inductor structure is formed by sandwiching a multilayer CZTB magnetic sheet between two distinct PCBs with copper tracks on each which form the upper and lower windings of the device. A solder reflow process utilizing solder balls mounted on the exposed NiAu pads of one of the PCBs is used to create the electrical connection between the two boards, hence, forming closed current loops for the windings of the inductor. This novel inductor structure enables the use of about 4 oz (<inline-formula> <tex-math notation="LaTeX">$140~mu ext{m}$ </tex-math></inline-formula>) of copper to enclose the multilayer CZTB magnetic sheet, and hence demonstrates very low <inline-formula> <tex-math notation="LaTeX">$R_{ ext {dc}}$ </tex-math></inline-formula>. The multilayer CZTB magnetic sheet is characterized by using a Ryowa permeameter. The magnetic sheet exhibited a permeability of 367. The manufactured flip-chip inductor was electrically characterized by using a vector network analyzer (VNA). The device has a footprint of 7.25 mm<sup>2</sup> and has an inductance of 52 nH. The fabricated PCB embedded inductor achieved a peak quality factor of 23 at 40 MHz.