Mechanical behavior of an electrodeposited nanostructured Cu with a mixture of nanocrystalline grains and nanoscale growth twins in submicrometer grains
Mechanical behavior of an electrodeposited nanostructured Cu with a mixture of nanocrystalline grains and nanoscale growth twins in submicrometer grains
复制标题
DOI：
10.1063/1.2999379
复制
发表时间：
2008-10
影响因子：
3.2
通讯作者：
Guoyong Wang;Zhonghao Jiang;Q. Jiang;J. Lian
中科院分区：
文献类型：
--
作者：
Guoyong Wang;Zhonghao Jiang;Q. Jiang;J. Lian
采用电沉积法制备了由纳米晶粒和亚微米晶粒中的纳米孪晶组成的纳米结构Cu，并在MTS-810系统上测试了其在不同应变速率和室温下的力学性能。该合金具有较高的屈服强度（506-717 MPa）和良好的塑性（6.2%~ 9.1%）。在纳米结构Cu中观察到两阶段应变速率敏感性（m值），不同的断裂方向，以及在高应变速率和低应变速率下不同的变形和断裂表面形貌，这表明变形机制从较高应变速率下的位错变形转变为较大晶粒中以位错变形为主，小晶粒中以晶界扩散和晶界滑动为主，低应变率
A nanostructured Cu with a mixture of nanocrystalline grains and nanoscale growth twins in submicrometer grains was synthesized by electrodeposition, and its mechanical behavior was tested on MTS-810 system at different strain rates and room temperature. It exhibited high yield stress of 506–717 MPa and good ductility of 6.2%–9.1%. Two stage strain rate sensitivity (m value), different fracture directions, and different morphologies of deformed and fracture surfaces at high strain rates and low strain rates were observed in the nanostructured Cu, which demonstrated the deformation mechanism transition from dislocation deformation at higher strain rates to both dislocation deformation dominated in larger grains and grain boundary diffusion and grain boundary sliding dominated in small grains at low strain rates.