Selectively Metalizable Stereolithography Resin for Three-Dimensional DC and High-Frequency Electronics via Hybrid Additive Manufacturing
Selectively Metalizable Stereolithography Resin for Three-Dimensional DC and High-Frequency Electronics via Hybrid Additive Manufacturing
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DOI：
10.1021/acsami.1c01199
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发表时间：
2021-05-07
影响因子：
9.5
通讯作者：
Li, Qianshuai
中科院分区：
文献类型：
--
作者：
Li, Ji;Zhang, Yan;Li, Qianshuai
定制最终用途电子产品的直接制造正在成为增材制造（AM）的新兴趋势。这高度要求传统增材制造工艺的发展，从简单地构建单一材料零件到同时提供复杂的结构和最终使用功能。在这项工作中，我们提出了一种新颖的混合增材制造解决方案，该解决方案结合了立体光刻 (SLA) 三维 (3D) 打印和激光激活化学镀，用于制造 3D 全功能电子产品。我们新开发的功能性 SLA 树脂可以进行 3D 打印、激光激活，然后选择性金属化，可以在 3D 结构上自由图案化高分辨率电路。凭借高性能电气材料，该技术不仅能够制造 3D 直流 (DC) 电子产品，还能够制造微波/毫米波天线等 3D 高频器件，而这些器件无法通过传统印刷电路板 (PCB) 技术制造，甚至大多数 AM 工艺也无法制造。这项研究代表了增材制造技术的重大进步，更重要的是为全功能3D电子产品的大规模定制提供了独特的机会，在消费电子、通信工程以及汽车和航空航天工业中显示出巨大的潜力。
Direct manufacturing of customized end-use electronic products is becoming an emerging trend of additive manufacturing (AM). This highly demands the evolution of the conventional AM processes from simply building single-material parts to simultaneously delivering complex structures and end-use functionalities. In this work, we propose a novel hybrid additive manufacturing solution that combines stereolithography (SLA) three-dimensional (3D) printing and laser-activated electroless plating for the manufacture of 3D fully functional electronic products. With our newly developed functional SLA resin that can be 3D printed, laser-activated, and thereafter selectively metalized, high-resolution circuitry can be free-formly patterned on 3D structures. In virtue of high-performance electrical materials, this technology is capable of creating not only 3D direct-current (DC) electronics but also 3D high-frequency devices like microwave/millimeter-wave antennas, which cannot be fabricated via traditional printed circuit board (PCB) technology and not even by most AM processes. This study represents a significant advance in additive manufacturing technologies, and more importantly offers a unique opportunity for the mass customization of fully functional 3D electronic products, which shows great potentials in consumer electronics, communication engineering, and automobile and aerospace industries.