Interface Bonding characteristics and mechanical properties of H68/AZ31Mg clad plate
Interface Bonding characteristics and mechanical properties of H68/AZ31Mg clad plate
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H68/AZ31Mg复合板的界面结合特性及力学性能
DOI：
10.1007/s12613-020-2240-8
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通讯作者：
Zhifeng Yan
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作者：
Tingting Zhang;Wenxian Wang;Jie Zhang;Zhifeng Yan
对H68/AZ 31 B爆炸复合板的界面结合、组织和力学性能进行了系统研究。结果表明，连接界面呈“波浪状”结构，包含3个典型的区域/层：（1）与H68黄铜板相邻的扩散层;（2）界面处熔融金属的凝固层;（3）AZ 31 B合金发生严重变形一侧的凝固层。在熔凝层中观察到Cu、CuZn 2和α-Mg的混合相。在H68合金一侧发现了规则的多边形晶粒并伴有孪晶，而在AZ 31 B合金一侧则发现了细小的等轴晶。纳米压痕结果显示，在结合界面处形成了脆性的金属间化合物CuZn 2相。由于Cu、Zn和Mg原子在界面上的扩散以及部分熔化的H68和AZ 31 B合金的相变反应，界面通过冶金反应得到良好的结合。
Interfacial bonding, microstructures, and mechanical properties of an explosively-welded H68/AZ31B clad plate were systematically studied. According to the results, the bonding interface demonstrated a “wavy-like” structure containing three typical zones/layers: (1) diffusion layer adjacent to the H68 brass plate; (2) solidification layer of melted metals at the interface; (3) a layer at the side of AZ31B alloy that experienced severe deformation. Mixed copper, CuZn2, and α-Mg phases were observed in the melted-solidification layer. Regular polygonal grains with twins were found at the H68 alloy side, while fine equiaxed grains were found at the AZ31B alloy side near the interface due to re-crystallization. Nanoindentation results revealed the formation of brittle intermetallic CuZn2phases at the bonding interface. The interface was bonded well through metallurgical reactions due to diffusion of Cu, Zn, and Mg atoms across the interface and metallurgic reaction of partially melted H68 and AZ31B alloys.