Scattering in Fatigue Crack Growth of Thin Pure Copper Sheet for Smart Stress Memory Patch
Scattering in Fatigue Crack Growth of Thin Pure Copper Sheet for Smart Stress Memory Patch
复制标题
智能应力记忆贴片纯铜薄板疲劳裂纹扩展中的散射
DOI：
10.2355/isijinternational.47.1687
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发表时间：
2007
影响因子：
1.8
通讯作者：
M. Enoki
中科院分区：
文献类型：
--
作者：
S. Nambu;M. Enoki
提出了一种新的应力传感方法--“智能应力记忆贴片”。该贴片可以根据裂纹长度估计循环次数和应力幅值。在这项研究中，分散在薄铜试样的疲劳裂纹扩展进行了调查，以评估估计的循环次数的误差。制备了薄厚度的轧制铜和电沉积（艾德）铜。通过疲劳试验得到了各试样的疲劳裂纹扩展规律，大晶粒试样的疲劳裂纹扩展规律具有较大的离散性。观察到的裂纹路径和断口表明，大晶粒尺寸影响裂纹扩展的散射。利用随机模型分析了厚度和晶粒尺寸对散射的影响。此外，估计的循环数的误差表明，使用小晶粒尺寸的样品，如作为接收的艾德铜的智能应力记忆贴片的记忆应力的测量精度提高。
A new sensing method called “smart stress memory patch” has been developed. This patch can estimate the number of cycles and the stress amplitude using its crack length. In this study, the scattering in the fatigue crack growth of the thin copper specimen was investigated to evaluate the error of estimated number of cycles. The rolled and the electrodeposited (ED) Cu with thin thickness were prepared. The fatigue test was performed to obtain the fatigue crack growth of each sample and the fatigue crack growth behaviors of specimens with large grain size demonstrated large scatter. The observed crack path and fracture surface indicated that large grain size affects scattering in crack growth. The effect of thickness and grain size on the scattering was also evaluated by the stochastic model. Furthermore, the error of estimated number of cycles demonstrated that the accuracy of measurement for memorized stress is improved using a specimen with small grain size such as as-received ED Cu for smart stress memory patch.