Localized electrochemical deposition of micrometer copper columns by pulse plating
Localized electrochemical deposition of micrometer copper columns by pulse plating
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DOI：
10.1016/j.electacta.2009.11.002
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发表时间：
2010-02
影响因子：
6.6
通讯作者：
J. Lin;T. Chang;J. H. Yang;Yi-wei Chen;C. Chuang
中科院分区：
文献类型：
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作者：
J. Lin;T. Chang;J. H. Yang;Yi-wei Chen;C. Chuang
研究了局部电化学沉积法制备微米级铜柱。为了获得直径均匀、结构紧凑、表面光滑的柱，在脉冲电流（PC）模式下导电的led优于在直流（DC）模式下导电的led。微参比电极用于监测led位置的电位。电势的测量允许估计局部铜离子浓度，这是由电化学还原的动态消耗和质量传输的供应引起的。测定了电镀电流，评价了电化学还原速率。采用基于扩散的理论计算方法估计了铜离子的传质速率。表面形态和内部结构受到这种局部浓度的显著影响，而这种局部浓度又由电压和所采用的占空比决定。讨论了在PC模式下发光的机理。
Micrometer copper column fabrication by localized electrochemical deposition (LECD) was investigated in this study. To obtain columns with uniform diameter, compact structure and a smooth surface, LECD conducted in pulse current (PC) mode was better than that conducted in direct current (DC) mode. A micro-reference electrode was used to monitor the potential at the LECD site. Measurement of this potential permitted estimation of the local copper ion concentration resulting from their dynamic consumption by electrochemical reduction and their supply by mass transport. The electroplating current was measured in order to evaluate the rate of electrochemical reduction. The mass-transfer rate of copper ions was estimated using a theoretical calculation based on diffusion. The surface morphology and internal structure were significantly affected by this local concentration, which was in turn governed by the electrical voltage and the duty cycle employed. The mechanism for LECD conducted in PC mode is discussed.