On using the anisotropy in the thermal resistance of solid–fluid interfaces to more effectively cool nano-electronics
On using the anisotropy in the thermal resistance of solid–fluid interfaces to more effectively cool nano-electronics
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DOI：
10.1080/08927022.2019.1684488
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发表时间：
2020-01
影响因子：
2.1
通讯作者：
Xiaoyu Wang;D. Venerus;I. Puri;S. Murad
中科院分区：
文献类型：
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作者：
Xiaoyu Wang;D. Venerus;I. Puri;S. Murad
摘要随着功率密集型电子元件被进一步封装到纳米器件中，它们的散热是一个严重的操作和安全问题。虽然纳米通道和纳米鳍通常用于促进散热，但形成的液-固界面（Kapitza阻力）成为热传递的显著障碍。我们证明，这些接口的热阻是强烈的各向异性。界面对平行于界面（固体表面）的热传递的阻力显著小于更公知的Kapitza阻力（与穿过界面的热传递相关联-垂直于固体表面），并且甚至低于本体流体的阻力。因此，如果器件被设计为平行于界面散热，则可以显著增强散热。我们的研究也能够解释所观察到的界面电阻各向异性的分子基础，这迄今为止仍然没有报道的固-液界面。
ABSTRACT As power-intensive electronic components are further miniaturised into nanodevices, their heat dissipation is a serious operational and safety concern. While nanochannels and nanofins are often used for facilitating heat dissipation, the liquid-solid interfaces that form (Kapitza resistance), become significant barriers to heat transfer. We demonstrate that the thermal resistance of these interfaces is strongly anisotropic. The resistance of an interface to heat transfer parallel to the interface (solid surface) is significantly smaller than the more well-known Kapitza resistance (associated with heat transfer across the interface – perpendicular to the solid surface) and is even lower than that of the bulk fluid. As a result, if devices are designed to dissipate heat parallel to an interface, heat dissipation can be significantly enhanced. Our studies are also able to explain the molecular basis of this observed anisotropy in interfacial resistance, which has hitherto remained unreported for solid–liquid interfaces.