Solid-state dewetting of Au/Ni bilayers: The effect of alloying on morphology evolution
Solid-state dewetting of Au/Ni bilayers: The effect of alloying on morphology evolution
复制标题
DOI:
10.1063/1.4891448
复制
发表时间:
2014-07-28
影响因子:
3.2
通讯作者:
Schaaf, P.
中科院分区:
文献类型:
--
作者:
Herz, A.;Wang, D.;Schaaf, P.
The solid-state dewetting of thin Au/Ni bilayers deposited onto SiO2/Si substrates is investigated. A rapid thermal treatment is used to induce the dewetting process by an increase in temperature. The evolution of the (111) peaks of X-ray diffraction reveals a characteristic change due to mixing of Au and Ni. At low temperature, the Au-Ni thin film is found to break up at the phase boundaries and growing voids are shown to be surrounded by a Ni-rich phase. Branch-like void growth is observed. Upon annealing at increasing temperatures, Au-Ni solid solutions are formed well above the bulk equilibrium solubility of Au and Ni. It is found that this metastable phase formation makes the Au-Ni thin film less vulnerable to rupturing. Moreover, growth mode of still evolving voids changes into a more regular, faceted one due to alloying. Finally, it is shown that annealing above the miscibility gap forms supersaturated, well-oriented Au-Ni solid solution agglomerates via dewetting. (C) 2014 AIP Publishing LLC.