Effects of Elemental Additives on Densification, Microstructure, Strength, and Thermal Conductivity of Silicon Carbide Ceramics
Effects of Elemental Additives on Densification, Microstructure, Strength, and Thermal Conductivity of Silicon Carbide Ceramics
复制标题
元素添加剂对碳化硅陶瓷致密化、微观结构、强度和导热性能的影响
DOI：
10.1111/j.1551-2916.1986.tb00009.x
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发表时间：
1986
期刊：
影响因子：
--
通讯作者：
M. Ura
中科院分区：
文献类型：
--
作者：
Y. Takeda;Kousuke Nakamura;K. Maeda;M. Ura
研究了元素添加剂对热压SiC陶瓷的致密化、显微结构、强度和热导率的影响。Be、B和Al的加入使合金的密度达到理论密度的98%，而其它添加剂对致密化的影响很小。致密SiC陶瓷的显微结构，抗弯强度和热导率变化很大，这取决于所使用的添加剂。例如，添加Al的SiC陶瓷具有尺寸为−2.3 μm的细晶粒和高抗弯强度，达到10940 MN/m2。另一方面，添加Be或B的那些具有较大的晶粒尺寸分别为5.7和4.2，并且具有较低的弯曲强度分别为400和290 MN/m2。此外，添加Be的一个非常高的热导率，260 W/m·K，获得了这个值远远大于那些与B或Al添加SiC陶瓷。
Effects of elemental additives on the densification, microstructure, strength, and thermal conductivity of hot‐pressed SiC ceramics were investigated. The addition of Be, B, and Al gave up to 98% of theoretical density, whereas other additives had only a slight effect on densification. The microstructure, flexural strength, and thermal conductivity of dense SiC ceramics varied considerably depending on the additive used. For example, SiC ceramics with added Al had fine grains −2.3 μm in size and high flexural strength, ≅ 940 MN/m2. On the other hand, those with added Be or B had larger grains ≅ 5.7 and ≅4.2 in size and lower flexural strengths ≅400 and ≅ 290 MN/m2, respectively. Moreover, with added Be an extremely high thermal conductivity, ≅ 260 W/m·K, was obtained; this value is much larger than those for SiC ceramics with B or Al additions.