Loading rate response on shear mechanical properties of conductive adhesive with different silver contents
Loading rate response on shear mechanical properties of conductive adhesive with different silver contents
复制标题
加载速率对不同银含量导电胶剪切力学性能的响应
DOI：
10.1080/01694243.2020.1749405
复制
发表时间：
2020
影响因子：
2.3
通讯作者：
Xuefeng Shu
中科院分区：
文献类型：
--
作者：
Xinkuo Ji;Xiaochao Jin;Cheng Hou;Gesheng Xiao;Xueling Fan;Xuefeng Shu
摘要环氧基各向同性导电胶（伊卡）由于具有工艺温度低、线路印制微细、互连容易等优点，已成为微电子封装领域的主导材料。在电子产品的服役过程中，由于封装芯片与基板之间的机械失配，使得伊卡接头承受剪切载荷。采用纯铜板状被粘物制备了不同银片含量（50 wt%和70 wt%）的单搭接接头试样，进行了不同加载速率下的拉伸剪切试验。从理论上推导了剪切应力与胶层位置的关系。伊卡的界面断裂能、剪切强度、断裂位移以及粘结层中的剪切应力集中均随加载速率的增加而增加。银片含量较高的伊卡的剪切应力集中相对较大。
Abstract Epoxy-based isotropic conductive adhesives (ICA) have become the dominant materials in the microelectronic packaging field due to their advantages of low technological temperature, ultrafine line printing, and easy interconnection. During the service of electronic products, the ICA joints are subjected to shear loads induced by mechanical mismatch between packaging chip and substrate. In this work, the joint specimens with different contents of silver flakes (50 wt% and 70 wt%) prepared using pure copper plate adherend in the form of single-lap were used for the tensile–shear tests under different loading rates. The relationship between shear stress and location of the adhesive layer was theoretically derived. The interface fracture energy, shear strength, and fracture displacement of ICA, as well as concentration of shear stress in the adhesive layer, increase with the increase in loading rate. The shear stress concentration is relatively greater for the ICA with higher content of silver flakes.