Heterogeneous three-dimensional electronics by use of printed semiconductor nanomaterials
Heterogeneous three-dimensional electronics by use of printed semiconductor nanomaterials
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DOI：
10.1126/science.1132394
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发表时间：
2006-12-15
期刊：
影响因子：
56.9
通讯作者：
Rogers, John A.
中科院分区：
文献类型：
--
作者：
Ahn, Jong-Hyun;Kim, Hoon-Sik;Rogers, John A.
我们开发了一种简单的方法，将联合收割机广泛的不同材料组合成具有二维或三维布局的异质集成电子系统。该过程开始于不同半导体纳米材料的合成，例如单壁碳纳米管和单晶微米和纳米级线以及在单独衬底上的氮化镓、硅和砷化镓的带。重复应用增材转印工艺，该工艺使用具有这些衬底作为供体的软印模，随后形成器件和互连，产生了在刚性或柔性器件衬底上结合半导体纳米材料的任何组合的高性能异质集成电子器件。这种通用的方法可以产生各种不寻常的电子系统，这是不可能实现的其他技术。
We developed a simple approach to combine broad classes of dissimilar materials into heterogeneously integrated electronic systems with two- or three-dimensional layouts. The process begins with the synthesis of different semiconductor nanomaterials, such as single-walled carbon nanotubes and single-crystal micro- and nanoscale wires and ribbons of gallium nitride, silicon, and gallium arsenide on separate substrates. Repeated application of an additive, transfer printing process that uses soft stamps with these substrates as donors, followed by device and interconnect formation, yields high-performance heterogeneously integrated electronics that incorporate any combination of semiconductor nanomaterials on rigid or flexible device substrates. This versatile methodology can produce a wide range of unusual electronic systems that would be impossible to achieve with other techniques.