Inkjet-printed copper electrodes using photonic sintering and their application to organic thin-film transistors
Inkjet-printed copper electrodes using photonic sintering and their application to organic thin-film transistors
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DOI：
10.1016/j.orgel.2015.06.026
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发表时间：
2015-10-01
影响因子：
3.2
通讯作者：
Tokito, Shizuo
中科院分区：
文献类型：
--
作者：
Norita, Shohei;Kumaki, Daisuke;Tokito, Shizuo
我们报道了用喷墨打印的纳米颗粒油墨在聚合物介质层上进行光子烧结制成的铜电极及其在有机薄膜晶体管(TFT)中的源极和漏极中的应用。利用辐射能量密度为9J/cm(2)的光子烧结技术，在玻璃衬底上印刷的铜纳米颗粒层具有很低的电阻率水平，仅为7微欧姆厘米。通过优化聚合物介质上的烧结条件，使用这些印刷铜电极的并五苯基薄膜晶体管具有良好的迁移率水平0.13 cm(2)/vs和高的通断电流比约10(6)。此外，我们还发现，由于强光的高辐射能量密度，聚合物底层的热损伤抑制了印刷铜电极附近并五苯的晶粒生长。(C)2015爱思唯尔B.V.保留所有权利。
We report on copper (Cu) electrodes fabricated with inkjet-printed nanoparticle inks that are photonic sintered on a polymer dielectric layer and their application to source and drain electrodes in organic thin-film transistor (TFT). By using photonic sintering with a radiant energy density of 9 J/cm(2), printed Cu nanoparticle layers on a glass substrate showed very low electrical resistivity levels of 7 mu Omega cm. By optimizing the sintering conditions on polymer dielectric, the pentacene-based TFT using these printed Cu electrodes showed good mobility levels of 0.13 cm(2)/Vs and high on/off current ratios of about 10(6). In addition, we revealed that the crystal grain growth of pentacene near the printed Cu electrodes was inhibited by the thermal damage of polymer underlayer due to the high radiant energy density of the intense light. (C) 2015 Elsevier B.V. All rights reserved.