Fabrication of three-dimensional electrical connections by means of directed actin self-organization
Fabrication of three-dimensional electrical connections by means of directed actin self-organization
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DOI：
10.1038/nmat3569
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发表时间：
2013-05-01
期刊：
影响因子：
41.2
通讯作者：
Thery, Manuel
中科院分区：
文献类型：
--
作者：
Galland, Remi;Leduc, Patrick;Thery, Manuel
提高微电子器件性能的一个很有前途的方法是用堆叠电路构建三维（3D）芯片。然而，一个主要的障碍在于这些层之间密集的电互连阵列的制造，其可及性是有限的（1,2）。本研究表明，肌动蛋白丝的定向生长和自组织可以解决这一问题。我们通过肌动蛋白成核因子的微模式和肌动蛋白丝聚合的生化控制来定义三维肌动蛋白网络的形状和方向。从两个相对的层生长的网络能够相互渗透并形成机械稳定的连接，然后使用选择性金属化工艺将其涂上金。金属化自组织连接的导电性、稳健性和模块化使这种方法对3D芯片制造具有潜在的吸引力。
A promising approach to improve the performance of microelectronic devices is to build three-dimensional (3D) chips made of stacked circuits. However, a major hurdle lies in the fabrication of dense arrays of electrical interconnections between these layers, where accessibility is limited(1,2). Here we show that the directed growth and self-organization of actin filaments can offer a solution to this problem. We defined the shape and orientation of 3D actin networks through both micropatterning of actin nucleation factors and biochemical control of actin filament polymerization. Networks growing from two opposing layers were able to interpenetrate and form mechanically stable connections, which were then coated with gold using a selective metallization process. The electrical conductivity, robustness and modularity of the metallized self-organized connections make this approach potentially attractive for 3D chip manufacturing.