Degradation mechanism of ag-epoxy conductive adhesive/Sn-Pb plating interface by heat exposure
Degradation mechanism of ag-epoxy conductive adhesive/Sn-Pb plating interface by heat exposure
复制标题
银环氧树脂导电胶/Sn-Pb镀层界面的热降解机理
DOI：
10.1007/s11664-002-0124-5
复制
发表时间：
2002
影响因子：
2.1
通讯作者：
K. Suganuma
中科院分区：
文献类型：
--
作者：
M. Yamashita;K. Suganuma
通过力学性能测试、电学性能测试和金相组织观察，考察了银粉与高温锡铅合金的相容性。在150℃时的退化是由于锡从电镀层优先扩散到导电胶中的银中所致。通过这种扩散，在与镀层相邻的Ag填充物中形成了Ag-Sn金属间化合物，并在锡-铅镀层中形成了许多大的Kirkendall空洞。此外，热暴露后，导电胶与锡铅电镀层之间发生了界面剥离，并在自由表面附近观察到了锡铅电镀层。
The compatibility between Ag fillers and Sn-Pb plating at elevated temperature was examined by mechanical test, electrical test, and microstructure observation. The degradation at 150°C is caused by the preferential diffusion of Sn from the plating layer into Ag in the conductive adhesive. By this diffusion, Ag-Sn intermetallic compounds formed in the Ag fillers adjacent to the plating layer, and many large Kirkendall voids are formed in the Sn-Pb plating layer. Furthermore, an interfacial debonding occurred between the conductive adhesive, and the Sn-Pb plating layer is also observed near the free surface after heat exposure.