Modeling and Numerical Simulation on Thermomechanical Behavior of SMA Plates with Two-Way Shape Memory Effect
Modeling and Numerical Simulation on Thermomechanical Behavior of SMA Plates with Two-Way Shape Memory Effect
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DOI：
10.1177/104538901400438019
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发表时间：
2001-11
影响因子：
2.7
通讯作者：
T. Takagi;Yun Luo;Shunji Suzuki;M. Matsumoto;J. Tani
中科院分区：
文献类型：
--
作者：
T. Takagi;Yun Luo;Shunji Suzuki;M. Matsumoto;J. Tani
本文对具有双向形状记忆效应的形状记忆合金（SMA）板的热力学行为进行了现象学建模。SMA材料作为传感器或致动器的两个重要特性；热响应和变形伴随相变；用所提出的模型来描述。相变过程中的潜热效应近似表示为视比热作为相变温度的函数。基于对TWSME机理的物理认识，用新定义的相变膨胀系数描述了SMA板的相变诱发变形。通过对SMA板热力学行为的数值模拟与实验对比，验证了该模型的正确性。
Phenomenological modeling on the thermomechanical behavior of shape memory alloy (SMA) plates with two-way shape memory effect (TWSME) is presented in this paper. Two important characteristics of SMA materials as sensors or actuators; the thermal responses and the transformation accompanied deformation; are described by the proposed models. The latent heat effect during transformation is approximately expressed by an apparent specific heat as a function of transformation temperatures. The transformation-induced deformation of SMA plates is described by newly defined transformation expansion coefficients, based on the physical understanding of the mechanism of TWSME. The proposed model is verified by the comparison between numerical simulation and experiments on the thermomechanical behavior of SMA plates.