Nanostructured SmCo5 thin films with perpendicular anisotropy formed in a wide range of Sm-Co compositions.
Nanostructured SmCo5 thin films with perpendicular anisotropy formed in a wide range of Sm-Co compositions.
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DOI：
10.1166/jnn.2011.2720
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发表时间：
2011-03
影响因子：
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通讯作者：
L. Zhang;Hu Jf;Jingsheng Chen;Jie Ding
中科院分区：
文献类型：
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作者：
L. Zhang;Hu Jf;Jingsheng Chen;Jie Ding
在本工作中，我们在Cu/Ta衬底上制备了具有(0001)织构的SmCo5薄膜，在Sm(X)Co(100-x)组分的很大范围内(x=13.2约37.0)表现出垂直各向异性。在Sm16.7Co83.3(SmCo5)组分下，SmCo5薄膜表现出最大的垂直矫直力为18.2Koe，这归因于良好的结晶性和良好的(000l)织构。与标准粉末样品相比，SmCo5(000l)峰向小角度移动，表明SmCoCu合金是通过铜扩散形成的。该样品的EDX结果表明，样品的成分为SmCo3Cu2.1，这证实了铜在SmCo5层中的扩散。透射电子显微镜观察表明，SmCo5薄膜结晶良好，晶粒度为50 nm。
In this work, we prepared SmCo5 thin films with (0001) texture exhibiting perpendicular anisotropy in a wide range of Sm(x)Co(100-x) compositions (x = 13.2 approximately 37.0) on Cu/Ta underlayers. At a composition of Sm16.7Co83.3 (SmCo5), the SmCo5 film exhibits a maximum perpendicular coercivity of 18.2 kOe, which is attributed to a good crystallinity and an excellent (000l) texture. The SmCo5 (000l) peaks are shifted to smaller angles compared to the standard powder sample which indicates the formation of a SmCoCu alloy through Cu diffusion. The EDX result for this sample gives a composition of SmCo3Cu2.1 which confirms Cu diffusion into the SmCo5 layer. TEM image shows that SmCo5 film is well crystallized with a grain size of 50 nm.