Electro-kinetic microchannel cooling system for desktop computers
Electro-kinetic microchannel cooling system for desktop computers
复制标题
台式电脑电动微通道冷却系统
DOI：
10.1109/stherm.2004.1291297
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发表时间：
2004
期刊：
影响因子：
--
通讯作者：
M. Munch
中科院分区：
文献类型：
--
作者：
P. Zhou;J. Hom;G. Upadhya;K. Goodson;M. Munch
高性能台式计算机对热管理的要求正在迅速超越最佳商用主动和被动空气冷却解决方案的能力。问题在于三个复合趋势：a）更高的平均芯片功率密度，B）芯片热点中更高的峰值功率密度，以及c）更严格的系统边界条件。泵送液体冷却系统是解决这些热管理挑战的有前途的替代方案。我们在这里提出了一个电动微通道冷却系统的台式电脑，可以处理平均功率密度大于150 W/cm/sup 2/和热点的峰值功率密度的顺序为500 W/cm/sup 2/及以上。该冷却系统的特点是具有高热通量去除能力的微通道热交换器、用于以所需流速和压降输送流体的电动泵以及液体-空气热交换器。微通道热交换器非常适合微处理器上的热点冷却，固态电动泵安静、紧凑，并且由于没有移动部件而具有高可靠性。这份手稿描述了一个系统原型的模拟和实验，当完全集成时，在高性能台式计算机所需的边界条件内非常适合。
The requirements for thermal management in high performance desktop computers are rapidly outpacing the capabilities of the best commercially available active and passive air cooling solutions. The problem lies in three compounding trends: a) higher average chip power density, b) higher peak power densities in chip hotspots, and c) more stringent system boundary conditions. Pumped liquid cooling system is a promising alternative to address these thermal management challenges. We present here an electro-kinetic microchannel cooling system for desktop computers that can handle average power density greater than 150 W/cm/sup 2/ and hotspots with peak power densities on the order of 500 W/cm/sup 2/ and above. The cooling system features a microchannel heat exchanger for high heat flux removal capability, an electrokinetic pump for delivering fluid at the required flow rate and pressure drop, and a liquid-air heat exchanger. The microchannel heat exchanger is well suited for hotspot cooling on microprocessors, and the solid-state electro-kinetic pump is silent, compact, and promises high reliability through its lack of moving parts. This manuscript describes simulations and experiments on a system prototype, which, when fully integrated, fits well within the boundary conditions required for high performance desktop computers.