Brazing of Si3N4 ceramic to copper
Brazing of Si3N4 ceramic to copper
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DOI：
10.1016/s0924-0136(97)00427-5
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发表时间：
1998-05
影响因子：
6.3
通讯作者：
A. Elsawy;M. Fahmy
中科院分区：
文献类型：
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作者：
A. Elsawy;M. Fahmy
氮化硅是一种极具应用前景的高温结构陶瓷。将这种陶瓷连接到金属结构上的需求越来越大。使用活性填充金属直接钎焊是一种可靠而简单的技术，能够产生坚固可靠的接头。影响此类关节强度的几个因素已被研究并在文献中报道。这项初步研究主要是为了调查母材的表面处理和钎焊期间施加在接头上的载荷对钎焊接头强度的影响。实验进行了钎焊氮化硅与铜使用商业Ag-Cu-Ti活性填充金属有负载和无负载。测定了不同钎焊条件下Si3N4/Cu接头的抗剪强度和抗剪能。利用声发射传感技术检测裂缝的起裂。描述了键的形成机理，重点介绍了活性金属与接头材料的反应。对界面附着力和微观结构进行了研究。结果表明，铜母材表面光洁度越高，接头抗剪强度越高。由于在钎焊过程中对接头施加轻载荷，接头的剪切能大大增加。
Silicon nitride is one of the most promising structural ceramics for high temperature applications. There is an increasing demand for joining this ceramic to metal structures. Direct brazing using an active filler metal has been found to be a reliable and simple technique, capable of producing strong and reliable joints. Several factors affecting the strength of such joints have been investigated and are reported in the literature. This preliminary study is directed mainly towards investigating the effect of the surface preparation of the base metal and of the load applied to the joint during brazing on the strength of brazed joints. Experiments were conducted for brazing silicon nitride to copper using a commercial Ag–Cu–Ti active filler metal with and without applied load. The Si3N4/Cu joint shear strength and shear energy were determined for various brazing conditions. The initiation of the fracture was detected using acoustic emission sensing. The mechanism of bond formation is described, with emphasis placed on the active metal reaction with the joint materials. Both the interfacial adhesion and the microstructure were investigated. It was found that the smoother the surface finish of the copper base metal, the higher the joint shear strength attained. The shear energy of the joints increased substantially as a result of applying a light load on the joints during brazing.