Toward enhancing thermal conductivity of polymer-based thin films for microelectronics cooling
Toward enhancing thermal conductivity of polymer-based thin films for microelectronics cooling
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DOI：
10.1109/itherm.2017.7992500
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发表时间：
2017-05
期刊：
影响因子：
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通讯作者：
Hao Ma;Zhiting Tian
中科院分区：
文献类型：
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作者：
Hao Ma;Zhiting Tian
具有高导热系数的热界面材料可以有效地从电子器件中散热。碳纳米管/聚合物复合材料是一种很好的热界面材料。基于平衡分子动力学，计算了垂直排列的碳纳米管/聚乙烯(CNT/PE)复合材料的导热系数，并与垂直排列的CNT和PE进行了比较。结果表明，碳纳米管/聚乙烯复合材料沿取向方向的导热系数可达470.1±45.1W/(MK)，约为碳纳米管的40%，约为PE的16倍。这可以用态的振动密度很好地解释。定向碳纳米管/聚乙烯复合材料的超高导热系数可能为提高聚合物基热界面材料的跨面导热系数以实现高效的微电子冷却开辟了令人兴奋的机会。
Thermal interface materials with high thermal conductivity can remove heat efficiently from electronic devices. Carbon nanotube/polymer composite is a good candidate for thermal interface materials. We calculated the thermal conductivity of vertically aligned carbon nanotube/polyethylene (CNT/PE) composite and compared it with vertically aligned CNT and PE based on equilibrium molecular dynamics. We found that the thermal conductivity of CNT/PE composite along the alignment direction can be as high as 470.1±45.1 W/(mK), which is about 40% of that of CNT and about 16 times larger than that of PE. This can be well explained by vibrational density of states. The ultrahigh thermal conductivity of aligned CNT/PE composite may open up exciting opportunities towards enhancing the cross-plane thermal conductivity of polymer-based thermal interface materials for efficient microelectronics cooling.