Closed-Form Solution of Rough Conductor Surface Impedance

Closed-Form Solution of Rough Conductor Surface Impedance
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粗糙导体表面阻抗的闭式解

DOI:
10.1109/tmtt.2018.2864586
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发表时间:
2018
影响因子:
4.3
通讯作者:
D. Grujić
D. Grujić
中科院分区:
工程技术1区
文献类型:
--
作者:
D. Grujić

文献摘要

被引文献

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本文提出了一个封闭形式的解决方案,粗糙导体表面阻抗的材料直流电导率和RMS粗糙度。表面粗糙度是由位置相关的电导率在导体-电介质的边界,占粗糙的导体到电介质,这是第一次提出的梯度模型中的突起。通过近似高斯累积分布函数获得解析解,高斯累积分布函数用于模拟梯度模型中的位置相关电导率,具有双曲正切的平方。封闭形式的解决方案与数值解的梯度模型进行了比较,并在良好的协议高达100 GHz的频率。通过数值希尔伯特变换证明了导出的表面阻抗是因果关系。
This paper presents a closed-form solution of rough conductor surface impedance in terms of material DC conductivity and RMS roughness. Surface roughness is modeled by position-dependent conductivity at conductor-dielectric boundary to account for protrusion of rough conductor into dielectric, which was first proposed in the Gradient model. Analytic solution is obtained by approximating the Gauss cumulative distribution function, used to model the position-dependent conductivity in the Gradient model, with a square of hyperbolic tangent. Closed-form solutions are compared with numerical solutions of the Gradient model and are in good agreement up to a frequency of 100 GHz. Derived surface impedance is causal, which has been shown by numerical Hilbert transform.