Fuzzy gold electrodes for lowering impedance and improving adhesion with electrodeposited conducting polymer films
Fuzzy gold electrodes for lowering impedance and improving adhesion with electrodeposited conducting polymer films
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DOI：
10.1016/s0924-4247(02)00427-2
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发表时间：
2003-02-15
影响因子：
4.6
通讯作者：
Martin, DC
中科院分区：
文献类型：
--
作者：
Cui, XY;Martin, DC
对于其中导电聚合物电化学沉积在电极表面上的传感器和致动器装置，沉积的聚合物膜和基底金属电极之间的粘附对于保持长期性能至关重要。研究了在溅射金微电极上电镀金的方法，以提供一种用于电沉积导电聚合物粘附的模糊粗糙表面。结果表明，Au（CN）2（-）溶液的浓度和电流密度对沉积物的形貌有重要的控制作用。用交流阻抗谱定量比较了不同电流密度下溅射金和电沉积金的表面积。通过检查在低频极限下的阻抗响应，我们发现，在4.5 mM Au（CN）（2）（-）溶液中以125 nA沉积8分钟（沉积电荷密度为4.8 C/cm（2））的电镀金层得到的电沉积金层的有效表面积是溅射金层的8倍。这种表面积的增加导致随后沉积的电聚合导电聚合物的粘附性改善。沉积在电极上的导电聚合物PPy/PSS与模糊电镀金层预处理显示出类似于沉积在光滑的溅射金电极上的电化学性质和形态。证明了这些聚合物膜在模糊金基底上的粘附性的显著改善。(C)2002 Elsevier Science B. V.保留所有权利。
For sensor and actuator devices where conducting polymers are electrochemically deposited on the surface of electrodes, the adhesion between the deposited polymer film and substrate metal electrode is crucial for maintaining the long-term performance. Electroplating gold on sputtered gold microelectrode sites was studied as a means to provide a fuzzy, roughened surface for electrodeposited conducting polymers to adhere. It was found that concentration of Au(CN)(2)(-) solution and current density played important roles in controlling the morphology of the deposits. Impedance spectroscopy was used to quantitatively compare the surface area of sputtered gold and electrodeposited gold obtained by different current densities. By examining the impedance response in the limit of low frequencies, we found that the electroplated gold layer deposited at 125 nA out of a 4.5 mM Au(CN)(2)(-) solution for 8 min (deposition charge density of 4.8 C/cm(2)) gives an electrodeposited gold layer having eight times larger effective surface area compared to a sputtered gold layer. This increase in surface area leads to improved adhesion of the subsequently deposited electropolymerized conducting polymers. Conducting polymer PPy/PSS deposited on the electrodes that were preprocessed with a fuzzy electroplated gold layer showed electrochemical properties and morphologies similar to those deposited on smooth sputtered gold electrodes. A significant improvement on adhesion of these polymer films on the fuzzy gold substrate was demonstrated. (C) 2002 Elsevier Science B.V. All rights reserved.