A parametric hardware fine acceleration/deceleration algorithm and its implementation
A parametric hardware fine acceleration/deceleration algorithm and its implementation
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一种参数化硬件精细加减速算法及其实现
DOI：
10.1007/s00170-012-3975-9
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发表时间：
2012-02
影响因子：
3.4
通讯作者：
Chengrui Zhang
中科院分区：
文献类型：
--
作者：
Shuai ji;Tianliang Hu;Chengrui Zhang
速度控制是影响加工质量的重要因素。为了在加工速度变化时获得高的动态性能，已经提出了多种加/减速控制算法。利用多项式函数或数字卷积生成速度轮廓的技术在运动控制系统中得到了广泛的应用，并取得了良好的效果。然而，这些方法的控制周期都至少是一个插补区间，在加减速阶段，相邻两个插补区间之间的速度跳变是不可避免的。本文提出了一种单插补周期内的硬件精细加减速算法，使速度在插补区间内始终平滑变化。在此基础上，采用Verilog硬件描述语言设计了加减速精插补电路，并在现场可编程门阵列中实现。最后，将该算法应用于三轴运动控制器中，取得了较好的加工性能。
Speed control is a very important factor to machining quality. In order to get high dynamic performance at the time of the machining speed changing, many kinds of algorithm for the acceleration/deceleration control have been proposed. The techniques which employ polynomial functions or digital convolution to generate velocity profile have been widely used and achieved good performance in motion control system. However, the control cycle of all these methods is one interpolation interval at least, and the velocity jump between two adjacent interpolation intervals during the acceleration/deceleration stage cannot be avoided. In this paper, a hardware fine acceleration/deceleration algorithm inside a single interpolation cycle is proposed to make the velocity change smoothly all the time even inside the interpolation interval. Based on this approach, an acceleration/deceleration fine interpolation circuit is designed with Verilog hardware description language and implemented in field programmable gate array. At last, the algorithm is applied in a three-axes motion controller and achieves a better machining performance than the one without this algorithm.
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DOI：
10.1007/s00170-006-0834-6
发表时间：
2008-03
期刊：
The International Journal of Advanced Manufacturing Technology
影响因子：
--
作者：
R. Xu;Le Xie;Congxin Li;Daoshan Du
通讯作者：
R. Xu;Le Xie;Congxin Li;Daoshan Du
影响因子：
3.3
作者：
J. Jeon;Yun-ki Kim
通讯作者：
J. Jeon;Yun-ki Kim
影响因子：
4.7
作者：
S. Suh;Seong K. Kang;Dae-hyuk Chung;I. Stroud
通讯作者：
S. Suh;Seong K. Kang;Dae-hyuk Chung;I. Stroud
DOI：
10.1007/s00170-010-2975-x
发表时间：
2011-05
期刊：
The International Journal of Advanced Manufacturing Technology
影响因子：
--
作者：
Chuan Shi;P. Ye
通讯作者：
Chuan Shi;P. Ye
DOI：
--
发表时间：
1987-07
期刊：
--
影响因子：
--
作者：
K. Fu;R. González;C. S. Lee
通讯作者：
K. Fu;R. González;C. S. Lee