Enhanced strength and ductility at room and elevated temperatures of Al-Cu alloy matrix composites reinforced with bimodal-sized TiCp compared with monomodal-sized TiCp
Enhanced strength and ductility at room and elevated temperatures of Al-Cu alloy matrix composites reinforced with bimodal-sized TiCp compared with monomodal-sized TiCp
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与单峰尺寸 TiCp 相比，双峰尺寸 TiCp 增强的 Al-Cu 合金基复合材料在室温和高温下的强度和延展性更高
DOI：
10.1016/j.msea.2018.03.106
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发表时间：
2018-05-02
期刊：
影响因子：
6.4
通讯作者：
Jiang, Qi-Chuan
中科院分区：
文献类型：
--
作者：
Tian, Wei-Si;Zhao, Qing-Long;Jiang, Qi-Chuan
通过在Al-Cu合金熔体中原位添加微米级和纳米级TiCp-Al中间合金，成功制备了微米+纳米级双模态TiCp/Al-Cu复合材料。与Al-Cu基合金和单颗粒TiCp增强的Al-Cu基合金相比，双颗粒TiCp增强的Al-Cu基复合材料具有更细的α-Al晶粒和更小的θ（，）析出相，并具有更高的室温和高温强度和更高的塑性。纳米级和微米级TiCp的细化和强化作用使θ（，）析出相的尺寸减小，从而使TiCp具有更显著的析出强化作用，这是TiCp拉伸性能提高的主要原因。
The bimodal-sized (micron + nano) TiCp/Al-Cu composites were successfully fabricated by adding the in situ micron-sized and nano-sized TiCp-Al master alloys into the molten Al-Cu alloy. The composites reinforced with bimodal-sized TiCp exhibited finer alpha-Al grains and smaller theta(,) precipitates, and possessed enhanced room- and high-temperature strength and relatively high ductility compared with the Al-Cu matrix alloy and their counterparts reinforced with monomodal-sized TiCp. The improved tensile properties may be attributed to the more significant precipitation strengthening due to the smaller theta(,) precipitates, grain refinement and strengthening effects of the nano-sized and micron-sized TiCp.