Millimeter-wave monolithic integrated circuit interconnects using electromagnetic field coupling
Millimeter-wave monolithic integrated circuit interconnects using electromagnetic field coupling
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DOI：
10.1109/96.496029
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发表时间：
1996-05
期刊：
影响因子：
--
通讯作者：
G. Strauss;W. Menzel
中科院分区：
文献类型：
--
作者：
G. Strauss;W. Menzel
Standard interconnect and packaging techniques for millimeter-wave monolithic integrated circuits (MIMIC's) tend to get more and more difficult at millimeter-wave frequencies due to the increased influence of discontinuities and tolerances, especially in conjunction with temperature and hermetic sealing. To overcome these problems, a novel concept is proposed based on electromagnetic field coupling. On this basis, coupling structures for feed-throughs out of a package as well as chip interconnects have been designed, fabricated, and tested in a scaled frequency range and in the original millimeter-wave frequency range showing good results with acceptable tolerance requirements.
