Ultrathin quasi-2D amorphous carbon dielectric prepared from solution precursor for nanoelectronics
Ultrathin quasi-2D amorphous carbon dielectric prepared from solution precursor for nanoelectronics
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DOI:
10.1038/s44172-023-00141-9
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发表时间:
2023-12
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通讯作者:
Fufei An;Congjun Wang;Viet Hung Pham;A. Borisevich;Jiangchao Qian;Kaijun Yin;Saran Pidaparthy
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作者:
Fufei An;Congjun Wang;Viet Hung Pham;A. Borisevich;Jiangchao Qian;Kaijun Yin;Saran Pidaparthy
Materials keeping thickness in atomic scale but extending primarily in lateral dimensions offer properties attractive for many emerging applications. However, compared to crystalline counterparts, synthesis of atomically thin films in the highly disordered amorphous form, which avoids nonuniformity and defects associated with grain boundaries, is challenging due to their metastable nature. Here we present a scalable and solution-based strategy to prepare large-area, freestanding quasi-2D amorphous carbon nanomembranes with predominant sp2bonding and thickness down to 1–2 atomic layers, from coal-derived carbon dots as precursors. These atomically thin amorphous carbon films are mechanically strong with modulus of 400 ± 100 GPa and demonstrate robust dielectric properties with high dielectric strength above 20 MV cm−1and low leakage current density below 10−4A cm−2through a scaled thickness of three-atomic layers. They can be implemented as solution-deposited ultrathin gate dielectrics in transistors or ion-transport media in memristors, enabling exceptional device performance and spatiotemporal uniformity.