In-Situ Analysis of Ultrashort Pulsed Laser Ablation with Pulse Bursts
In-Situ Analysis of Ultrashort Pulsed Laser Ablation with Pulse Bursts
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DOI：
10.2961/jlmn.2019.01.0015
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发表时间：
2019-04-01
影响因子：
1.1
通讯作者：
Finger, Johannes
中科院分区：
文献类型：
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作者：
Bornschlegel, Benedikt;Finger, Johannes
使用超短脉冲（USP）激光源的激光烧蚀能够以非常高的精度进行无接触材料加工，对加工工件的热影响可忽略不计。然而，在许多情况下，所实现的生产率对于工业应用来说仍然太低。为了提高USP激光加工的产量，有三种方法：使用快速光束偏转技术的高达几MHz的高重复率，脉冲串或多个激光焦点的并行加工。在高重复频率和脉冲群的情况下，连续脉冲的时间和空间距离变得如此之小，以至于等离子体和粒子的热积累和屏蔽效应显著影响加工质量和实现的效率。为了更好地了解这些仍然几乎没有调查的影响，我们在这项工作中应用在原位成像与ICCD相机在烧蚀过程中的铜和不锈钢的脉冲群，以评估过程发光的激发，以及它的关系，烧蚀效率和屏蔽效果。
Laser ablation using ultrashort pulsed (USP) laser sources enables contact free materials processing with very high precision at negligible thermal influence for the processed workpiece. However, the achieved productivity is still too low for industrial applications in many cases. To increase the throughput of USP laser processes, three approaches are followed: high repetition rates up to several MHz using fast beam deflection techniques, pulse bursts or parallel processing with multiple laser foci. In case of high repetition rates and pulse bursts the temporal and spatial distance of consecutive pulses becomes so small that heat accumulation and shielding effects of plasma and particles affect the processing quality and achieved efficiency significantly. In order to gain a better insight of these still barely investigated effects we apply in this work in situ imaging with an ICCD camera during ablation processes of copper and stainless steel with pulse bursts to evaluate the excitation of process luminescence as well as its relation to ablation efficiency and shielding effects.