Ultraviolet radiation curable epoxy resin encapsulant for light emitting diodes
Ultraviolet radiation curable epoxy resin encapsulant for light emitting diodes
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DOI：
10.1002/app.23189
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发表时间：
2006-04
影响因子：
3
通讯作者：
R. N. Kumar;Lim Yoke Keem;Ng Chee Mang;A. Abubakar
中科院分区：
文献类型：
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作者：
R. N. Kumar;Lim Yoke Keem;Ng Chee Mang;A. Abubakar
发光二极管目前是由热固化环氧树脂封装的。热固化系统需要在高温下长时间的固化周期。此外，由于树脂的粘弹性行为，树脂倾向于沿着连接线“蠕变”（Weisenberg效应），这导致可焊性问题。固化后的树脂需手工去除，费时费力。紫外线固化系统解决了这些问题。紫外光固化是一种在室温下进行的超快反应。由于固化速度快，无蠕变现象发生。紫外光固化技术比热固化技术具有更高的生产效率和节能效果。本文介绍了以环脂肪族二氧化物、双酚A二甘油酯醚和阳离子光引发剂诱导的环氧化新伏拉克为基础的紫外光固化配方的研究进展。通过“混合料试验设计”，得到了满足性能特性和耐久性严格要求的最优组合。
Light-emitting diodes are currently encapsulated by thermally curable epoxy resins. Thermal curing systems require long curing cycles at high temperatures. Further, because of viscoelastic behavior of the resin, the resin tends to "creep" along the connecting wires (Weisenberg effect), which causes solderability problem. The cured resin should be removed manually, which is time consuming and labor intensive. These problems are solved by the ultraviolet radiation curable systems. UV curing is an ultra-fast reaction and takes place at room temperature. No creep behavior occurs due to the rapidity of the curing. The UV curing technique can result in higher productivity and energy saving than the thermal process. This article presents results on the development of UV curable formulations based on cycloaliphatic diepoxide, diglycidyl ether of bisphenol A, and epoxidized novolac induced by cationic photoinitiators. "Mixture experimental design" was employed to arrive at the optimum composition, which meets the stringent demands of performance characteristics and durability.