Factors Affecting the Molybdenum Line Slope by Reactive Ion Etching
Factors Affecting the Molybdenum Line Slope by Reactive Ion Etching
复制标题
反应离子刻蚀钼线斜率的影响因素
DOI：
10.1149/1.2086829
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发表时间：
1990
影响因子：
3.9
通讯作者：
Y. Kuo
中科院分区：
文献类型：
--
作者：
Y. Kuo
用模拟方法和实验方法研究了影响反应离子刻蚀钼线斜率的因素。已经检查了用于钼蚀刻的CF{sub 4}/O{sub 2}混合物的等离子体化学和工艺参数。理论计算与实验结果相吻合。分析了腐蚀后钼的表面形貌和成分。利用RIE方法可以获得具有较大工艺窗口的高度倾斜的钼轮廓。
Factors affecting the slope of the reactive ion etched molybdenum line have been studied with a simulation method and with experiments. Plasma chemistry and process parameters of the CF{sub 4}/O{sub 2} mixture for the molybdenum etch have been examined. The theoretical calculation matches experimental results. Surface topography and composition of the etched molybdenum have been analyzed. A highly sloped molybdenum profile can be obtained by using the RIE method with a large process window.