Evolution of viscoelastic behavior of a curing LY5052 epoxy resin in the glassy state
Evolution of viscoelastic behavior of a curing LY5052 epoxy resin in the glassy state
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DOI：
10.1080/20550340.2016.1236223
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发表时间：
2016-01-01
影响因子：
--
通讯作者：
Varna, Janis
中科院分区：
文献类型：
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作者：
Saseendran, Sibin;Wysocki, Maciej;Varna, Janis
这项工作的目的是发展一种方法来分析固化历史对粘弹性储存模数的影响。提出了两种不同的实验方法，将材料暴露在不同的固化温度和固化时间序列中。使用标准的动态机械和热分析(DMTA)设备对演变的粘弹性特性进行了表征。因此，目前的研究仅限于无限小应变和线性粘弹性。以LY5052环氧树脂体系为例，对其储能模数E‘的频域特性进行了验证。结果表明，对于所研究的LY5052，确实可以假设热粘弹性性能的演变与固化历史无关。我们观察到，本文所研究的粘弹性模型约化时间表达式中的位移因子是两个位移函数的乘积，即温度位移函数和固化位移函数。
The aim of this work is to develop a methodology to analyze the influence of the curing history on the viscoelastic storage modulus. Two different experimental approaches are presented exposing the material to various cure temperature and cure time sequences. The evolving viscoelastic properties are characterized using standard Dynamic Mechanical and Thermal Analysis (DMTA) equipment. Therefore, the present study is limited to infinitesimally small strains and linear viscoelasticity only. The methodology is demonstrated using the LY5052 epoxy resin system for its storage modulus E' in the frequency domain. Results indicate that evolution of thermo-viscoelastic properties could be indeed assumed independent of the cure history for the investigated LY5052. We observe that the shift factor in the reduced time expression for the viscoelastic model examined in this paper is a product of two shift functions, namely the temperature and cure shift functions.