The Reliability of Microalloyed Sn-Ag-Cu Solder Interconnections Under Cyclic Thermal and Mechanical Shock Loading
The Reliability of Microalloyed Sn-Ag-Cu Solder Interconnections Under Cyclic Thermal and Mechanical Shock Loading
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DOI：
10.1007/s11664-014-3298-8
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发表时间：
2014-11-01
影响因子：
2.1
通讯作者：
Paulasto-Krockel, Mervi
中科院分区：
文献类型：
--
作者：
Mattila, Toni T.;Hokka, Jussi;Paulasto-Krockel, Mervi
在本研究中，比较了三种微合金化的锡-银-铜焊料互连成分(锡-3.1Ag-0.52铜、锡-3.0Ag-0.52铜-0.24Bi和锡-1.1银-0.52铜-0.1Ni)在机械冲击载荷(JESD22-B111标准)和循环热载荷(40+/-A 125℃，42分钟循环)条件下的性能。在跌落试验中，低银镍组分(锡-银-铜-镍)的平均跌落失效次数最多，而含铋合金(锡-银-铜-铋)的组件板的平均跌落失效次数最低。热循环测试结果表明，具有锡-银-铜-铋互连线的电路板性能最好，而具有锡-银-铜-镍互连线的电路板性能最差。在两种试验中，锡-银-铜都被放置在中间。在本文中，我们论证了焊料强度是一个重要的可靠性因素，较高的强度有利于提高热循环可靠性，但不利于可靠性下降。我们从三种焊料互连成分的显微组织和力学性能的角度讨论了这些发现，并在综合文献回顾的基础上，研究了焊料成分的差异如何影响互连的力学性能，并讨论了在两种加载条件下这种差异如何反映在失效机制上。
In this study, the performance of three microalloyed Sn-Ag-Cu solder interconnection compositions (Sn-3.1Ag-0.52Cu, Sn-3.0Ag-0.52Cu-0.24Bi, and Sn-1.1Ag-0.52Cu-0.1Ni) was compared under mechanical shock loading (JESD22-B111 standard) and cyclic thermal loading (40 +/- A 125A degrees C, 42 min cycle) conditions. In the drop tests, the component boards with the low-silver nickel-containing composition (Sn-Ag-Cu-Ni) showed the highest average number of drops-to-failure, while those with the bismuth-containing alloy (Sn-Ag-Cu-Bi) showed the lowest. Results of the thermal cycling tests showed that boards with Sn-Ag-Cu-Bi interconnections performed the best, while those with Sn-Ag-Cu-Ni performed the worst. Sn-Ag-Cu was placed in the middle in both tests. In this paper, we demonstrate that solder strength is an essential reliability factor and that higher strength can be beneficial for thermal cycling reliability but detrimental to drop reliability. We discuss these findings from the perspective of the microstructures and mechanical properties of the three solder interconnection compositions and, based on a comprehensive literature review, investigate how the differences in the solder compositions influence the mechanical properties of the interconnections and discuss how the differences are reflected in the failure mechanisms under both loading conditions.