High Bandwidth Thermal Covert Channel in 3-D-Integrated Multicore Processors
High Bandwidth Thermal Covert Channel in 3-D-Integrated Multicore Processors
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DOI：
10.1109/tvlsi.2022.3203430
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发表时间：
2022-09-20
影响因子：
2.8
通讯作者：
Salman, Emre
中科院分区：
文献类型：
--
作者：
Dhananjay, Krithika;Pavlidis, Vasilis F.;Salman, Emre
在移动的、台式机和服务器平台中，利用处理器内核之间的热耦合来秘密地传递敏感信息是一个严重的威胁。现有的基于温度的隐蔽通信工作通常依赖于控制高功率CPU应力程序的执行来传输机密信息。这种具有高功率程序的隐蔽通道通常更容易检测，因为它们会导致温度显著上升。在这项工作中，我们证明，通过利用垂直集成，它是足够的执行典型的SPLASH-2基准测试应用程序，以传输200位每秒（bps）的秘密数据通过热隐蔽通道。与传统的2-D集成电路（IC）中的隐蔽通信相比，3-D多核处理器的核之间的强垂直热耦合将隐蔽通信的速率提高了3.4倍。此外，我们表明，这种热通信在3-D IC的带宽是更有弹性的热干扰所造成的应用程序运行在其他核心。这种干扰的减少大大增加了这种攻击所构成的危险。我们还研究了减少勾结核心之间的层间重叠的效果，并表明，隐蔽通道带宽减少了高达62%，没有重叠。
Exploiting thermal coupling among the cores of a processor to secretly communicate sensitive information is a serious threat in mobile, desktop, and server platforms. Existing works on temperature-based covert communication typically rely on controlling the execution of high-power CPU stressing programs to transmit confidential information. Such covert channels with high-power programs are typically easier to detect as they cause significant rise in temperature. In this work, we demonstrate that by leveraging vertical integration, it is sufficient to execute typical SPLASH-2 benchmark applications to transfer 200 bits per second (bps) of secret data via thermal covert channels. The strong vertical thermal coupling among the cores of a 3-D multicore processor increases the rates of covert communication by 3.4 x compared to covert communication in conventional 2-D integrated circuits (ICs). Furthermore, we show that the bandwidth of this thermal communication in 3-D ICs is more resilient to thermal interference caused by applications running in other cores. This reduced interference significantly increases the danger posed by such attacks. We also investigate the effect of reducing intertier overlap between colluded cores and show that the covert channel bandwidth is reduced by up to 62% with no overlap.