Process-based cost modeling of photonics manufacture: the cost competitiveness of monolithic integration of a 1550-nm DFB laser and an electroabsorptive modulator on an InP platform
Process-based cost modeling of photonics manufacture: the cost competitiveness of monolithic integration of a 1550-nm DFB laser and an electroabsorptive modulator on an InP platform
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基于工艺的光子制造成本建模：InP 平台上 1550 nm DFB 激光器和电吸收调制器单片集成的成本竞争力
DOI：
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发表时间：
2006
影响因子：
4.7
通讯作者：
R. Kirchain
中科院分区：
文献类型：
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作者：
E. Fuchs;E. J. Bruce;Rajeev J Ram;R. Kirchain
组件的单片集成有望增加网络功能并减少包装费用。由于制造的复杂性和设备间故障的复杂性，集成也降低了产量。在经济上更倾向于一体化的程度上，缺乏共识。以往关于集成成本可行性的研究采用了高层次的估算方法。相反，本研究侧重于精确的行业细节，基于从光电供应链上20家公司收集的数据，建立了一个基于流程的设备制造成本模型。所提出的模型允许定义过程组织，包括测试，以及处理条件、操作特征和每个步骤的自动化级别。本研究的重点是在InP平台上集成1550 nm DFB激光器和电吸收调制器的成本影响。结果表明，无论生产规模如何，单片集成设计都比分立元件更具成本竞争力。主要的成本驱动因素是包装、测试和组装。利用模型投影、组件对准、键合和金属有机化学气相沉积（MOCVD）的技术细节被认为是技术改进对降低成本最关键的过程。这样的结果应鼓励探索进一步一体化的成本优势，并注重成本驱动的技术发展
The monolithic integration of components holds promise to increase network functionality and reduce packaging expense. Integration also drives down yield due to manufacturing complexity and the compounding of failures across devices. Consensus is lacking on the economically preferred extent of integration. Previous studies on the cost feasibility of integration have used high-level estimation methods. This study instead focuses on accurate-to-industry detail, basing a process-based cost model of device manufacture on data collected from 20 firms across the optoelectronics supply chain. The model presented allows for the definition of process organization, including testing, as well as processing conditions, operational characteristics, and level of automation at each step. This study focuses on the cost implications of integration of a 1550-nm DFB laser with an electroabsorptive modulator on an InP platform. Results show the monolithically integrated design to be more cost competitive over discrete component options regardless of production scale. Dominant cost drivers are packaging, testing, and assembly. Leveraging the technical detail underlying model projections, component alignment, bonding, and metal-organic chemical vapor deposition (MOCVD) are identified as processes where technical improvements are most critical to lowering costs. Such results should encourage exploration of the cost advantages of further integration and focus cost-driven technology development