Thermal conductivity of diamond-like carbon films
Thermal conductivity of diamond-like carbon films
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DOI：
10.1063/1.2362601
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发表时间：
2006-10-16
影响因子：
4
通讯作者：
Ferrari, A. C.
中科院分区：
文献类型：
--
作者：
Shamsa, M.;Liu, W. L.;Ferrari, A. C.
作者报道了从聚合氢化非晶碳（a-C：H）到四面体非晶碳（ta-C）的各种碳膜的热导率（K）。使用3 Ω方法进行测量。结果表明，热传导是由sp（3）相的数量和结构无序。如果sp（3）相是无定形的，则K与C-C sp（3）含量、密度和弹性常数成线性比例。聚合物和石墨膜具有最低的K（0.2- 0.3W/mK），氢化ta-C：H具有类似于lW/mK的K，并且ta-C具有最高的K（3.5W/mK）。如果sp（3）相有序，即使在诸如微米或纳米金刚石的小颗粒中，对于给定的密度、杨氏模量和sp（3）含量，也会发生强烈的K增加。(c)2006年，美国物理学会。
The authors report the thermal conductivity (K) of a variety of carbon films ranging from polymeric hydrogenated amorphous carbons (a-C:H) to tetrahedral amorphous carbon (ta-C). The measurements are performed using the 3 omega method. They show that thermal conduction is governed by the amount and structural disorder of the sp(3) phase. If the sp(3) phase is amorphous, K scales linearly with the C-C sp(3) content, density, and elastic constants. Polymeric and graphitic films have the lowest K (0.2-0.3 W/mK), hydrogenated ta-C:H has K similar to 1 W/mK, and ta-C has the highest K (3.5 W/mK). If the sp(3) phase orders, even in small grains such as in micro- or nanodiamond, a strong K increase occurs for a given density, Young's modulus, and sp(3) content. (c) 2006 American Institute of Physics.