Numerical Simulation of Tunnel Effect Transistors Employing Internal Field Emission of Schottky Barrier Junction
Numerical Simulation of Tunnel Effect Transistors Employing Internal Field Emission of Schottky Barrier Junction
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采用肖特基势垒结内场发射的隧道效应晶体管的数值模拟
DOI:
10.7567/ssdm.1993.c-1-2
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发表时间:
1993
期刊:
影响因子:
--
通讯作者:
J. Shirafuji
中科院分区:
文献类型:
--
作者:
R. Hattori;J. Shirafuji
Tunnel transistors employing internal field emission of the Schottky barrier junction (SBTT) are expected to be a promising component for high-density and low-cost integrated circuits. In order to characterize the performance of SBTT, we carried out 2-D numerical simulation on four typical device structures. The output characteristics of SBTT are basically triodelike; that is, the drain current increases exponentially with increasing gate voltage, having high and nonlinear transfer performance, as elucidated by the simulation. This triodelike characteristic is observed when the channel layer is thicker than the depletion layer width formed by gate bias near the drain. In the case of a thin channel layer, a saturation feature of the drain current with increasing gate bias appears due to a pinch-off effect, which is favorable for reducing the leakage current in the off state. A prototype n-channel SBTT of crystalline silicon was fabricated and its transistor action was confirmed.