Miniaturizing a Chip-Scale Spectrometer Using Local Strain Engineering and Total-Variation Regularized Reconstruction

Miniaturizing a Chip-Scale Spectrometer Using Local Strain Engineering and Total-Variation Regularized Reconstruction
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DOI:
10.1021/acs.nanolett.2c02654
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发表时间:
2022-10-12
期刊:
影响因子:
10.8
通讯作者:
Ku,Pei-Cheng
Ku,Pei-Cheng
中科院分区:
材料科学1区
文献类型:
--
作者:
Sarwar,Tuba;Yaras,Can;Ku,Pei-Cheng

文献摘要

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A wafer-thin chip-scale portable spectrometer suitable for wearable applications based on a reconstructive algorithm was demonstrated. A total of 16 spectral encoders that simultaneously functioned as photodetectors were monolithically integrated on a chip area of 0.16 mm2by applying local strain engineering in compressively strained InGaN/GaN multiple quantum well heterostructures. The built-in GaN pn junction enabled a direct photocurrent measurement. A non-negative least-squares (NNLS) algorithm with total-variation regularization and a choice of a proper kernel function was shown to deliver a decent spectral reconstruction performance in the wavelength range of 400–645 nm. The accuracies of spectral peak positions and intensity ratios between peaks were found to be 0.97% and 10.4%, respectively. No external optics, such as collimation optics and apertures, were used, enabled by angle-insensitive light-harvesting structures, including an array of cone-shaped backreflectors fabricated on the underside of the sapphire substrate.