A 3D-HARPSS Polysilicon Microhemispherical Shell Resonating Gyroscope: Design, Fabrication, and Characterization
A 3D-HARPSS Polysilicon Microhemispherical Shell Resonating Gyroscope: Design, Fabrication, and Characterization
复制标题
DOI：
10.1109/jsen.2015.2431857
复制
发表时间：
2015-09-01
影响因子：
4.3
通讯作者：
Ayazi, Farrokh
中科院分区：
文献类型：
--
作者：
Shao, Peng;Tavassoli, Vahid;Ayazi, Farrokh
本文提出了，第一次，分析，设计，制造和表征的微半球谐振陀螺仪（亩HRG）。开发了3D高纵横比多晶硅和单晶硅（HARPSS）工艺，用于制造杆支撑的半球形外壳，该外壳具有自对准高电容电极，用于陀螺仪的驱动、传感和调谐。单片工艺由七个光刻步骤组成，将HARPSS工艺与3D弯曲微结构的制造相结合，以创建具有可扩展电容间隙的电极。制造成功地证明了与多晶硅亩HRG原型的直径为1.2毫米，1 μ m的外壳厚度。使用集成电极测量频率响应并检查陀螺仪操作。模式匹配和模式对准成功地执行通过施加调谐和正交零电压。测得闭环速率灵敏度比例因子为8.57 mV/degree/s。此外，支撑结构的设计和工艺优化导致质量因子的改善（Q类似于40 000）。
This paper presents, for the first time, the analysis, design, fabrication, and characterization of a microhemispherical resonating gyroscope (mu HRG). A 3D high aspect-ratio poly- and single-crystalline silicon (HARPSS) process is developed to fabricate a stem-supported hemispherical shell with self-aligned tall capacitive electrodes intended for driving, sensing, and tuning of the gyroscope. The monolithic process consists of seven lithographic steps combining the HARPSS process with fabrication of a 3D curved microstructure to create electrodes with scalable capacitive gaps. The fabrication is successfully demonstrated with polysilicon mu HRG prototypes with a diameter of 1.2 mm and a shell thickness of 1 mu m. The frequency response is measured and gyro operation is examined using the integrated electrodes. Mode matching and mode alignment are successfully performed by applying tuning and quadrature nulling voltages. A closed-loop rate sensitivity scale factor of 8.57 mV/degrees/s was measured. Furthermore, design and process optimization of the support structure resulted in an improved quality factor (Q similar to 40 000).