Chemical modification of fluorinated polyimides: New thermally curing hybrid polymers with POSS
Chemical modification of fluorinated polyimides: New thermally curing hybrid polymers with POSS
复制标题
DOI：
10.1021/ma060372d
复制
发表时间：
2006-07-11
期刊：
影响因子：
5.5
通讯作者：
Brunsvold, A
中科院分区：
文献类型：
--
作者：
Wright, ME;Petteys, BJ;Brunsvold, A
合成了四种新型封端羟甲基化聚酰亚胺。通过两步化学改性过程，将（3-氨丙基）（七叔丁基）多面体低聚倍半硅氧烷（POSS）共价连接到聚合物主链上。POSS的负载量高达36重量%，同时保持优良的加工性能和薄膜的光学清晰度。氰酸酯或甲基丙烯酸羟乙酯（HEMA）基团的同时连接提供了可加工的POSS-聚酰亚胺，其经历热固化以产生耐溶剂膜，两者的最终T-g为251 ℃。固化反应的动力学分析得到的活化能为93 kJ/mol（氰酸酯）和103 kJ/mol（HEMA）。相对于Kapton H标准，含有31重量% POSS的POSS-聚酰亚胺暴露于原子氧显示出不可测量的侵蚀水平。
A series of four new end-capped and hydroxymethyl-functionalized polyimides were prepared. Through a two-step chemical modification process (3-aminopropyl)(hepta-i-butyl) polyhedral oligomeric silsesquioxane (POSS) was covalently attached to the polymer backbone. POSS loading levels as high as 36 wt % could be obtained while maintaining excellent processability and optical clarity of thin films. Concurrent attachment of either a cyanate ester or hydroxyethyl methacrylate ( HEMA) group afforded processable POSS-polyimides that underwent thermal curing to yield solvent-resistant films, both having final T-g's of 251 degrees C. Kinetic analysis of the cure reactions yielded energy of activations of 93 kJ/mol (cyanate ester) and 103 kJ/mol (HEMA). Exposure of a POSS-polyimide containing degrees 31 wt % POSS to atomic oxygen displayed no measurable level of erosion relative to a Kapton H standard.