Ferroelectric Sr2(Ta1-x, Nbx)2O7 with a Low Dielectric Constant by Plasma Physical Vapor Deposition and Oxygen Radical Treatment
Ferroelectric Sr2(Ta1-x, Nbx)2O7 with a Low Dielectric Constant by Plasma Physical Vapor Deposition and Oxygen Radical Treatment
复制标题
等离子体物理气相沉积和氧自由基处理制备低介电常数铁电体Sr2(Ta1-x, Nbx)2O7
DOI:
10.1143/jjap.42.2050
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发表时间:
2003
期刊:
影响因子:
--
通讯作者:
T. Ohmi
中科院分区:
文献类型:
--
作者:
I. Takahashi;H. Sakurai;A. Yamada;Kiyoshi Funaiwa;Kentarou Hirai;S. Urabe;T. Goto;M. Hirayama;A. Teramoto;S. Sugawa;T. Ohmi
The compounds of the Sr2Nb2O7 (SNO) family are suitable for use as ferroelectric materials for ferroelectric memory field effect transistors (FETs), because these substances have a low dielectric constant and high heat-resistance. A very low dielectric constant ferroelectric Sr2(Ta1-x,Nbx)2O7 (STN) film formation technology which is applied to floating gate type ferroelectric random access memory (FFRAM) has been developed. The high ferroelectric performance of the STN capacitor has been achieved by plasma physical vapor deposition and an oxygen radical treatment using microwave-excited (2.45 GHz) high-density (>1012 cm-3) low electron temperature (<1 eV) Kr/O2 plasma.