A study of direct liquid cooling for high-density chips and accelerators
A study of direct liquid cooling for high-density chips and accelerators
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高密度芯片和加速器直接液冷研究
DOI：
10.1109/itherm.2017.7992537
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发表时间：
2017
期刊：
影响因子：
--
通讯作者：
A. Heydari
中科院分区：
文献类型：
--
作者：
Tianyi Gao;Shuai Shao;Yan Cui;Bryan Espíritu;Charles Ingalz;Hu Tang;A. Heydari
在高功率密度冷却的情况下，液体冷却提供了一种可行的热管理解决方案，此外，它还为提高数据中心的能源效率提供了几个优点。例如，液体冷却解决方案可以消除在数据中心冷却基础设施中使用常规冷却器。由于大部分热量可以直接提取到液体中，因此可以显著降低对冷却气流的需求，特别是在冷却高功率密度机架的情况下。由于冷水机压缩机和CRAH/CRAC消耗大量的电力，因此可以实现大量的节能。通过适当的设计和部署，在某些情况下，直接液体冷却解决方案可能是许多现有数据中心冷却技术的经济有效的替代方案。这项工作的重点是在冷却高密度处理器芯片和GPU加速器的情况下使用冷板的直接液体冷却技术。本文总结了两部分工作：实验测试工作和CFD建模研究。在建模研究中，开发了使用商用CFD软件包的不同方法。几个紧凑的液体冷却冷板模型的开发和验证实验数据。结果显示出良好的一致性。在实验工作中，在实验室研制了单相泵送液体系统实验装置，并用于液体冷却实验。测试设置能够将流体供应温度和流体质量流率调整到设计的测试条件。在系统中使用电加热器以向冷板产生高流体供应温度，例如45°C或甚至更高。在目前的工作中，热模拟芯片和实际的GPU加速器用于表征冷板液体冷却性能。
Liquid cooling provides a feasible thermal management solution in the case of high power density cooling, in addition, it offers several advantages for improving data center energy efficiency. For example, liquid cooling solution may eliminate the utilization of conventional chiller in a data center cooling infrastructure. Since a large portion of heat can be extracted directly to the liquid, the requirement of cooling airflow can is significantly decreased, especially in the cases of cooling high power density racks. A great amount of energy saving maybe achieved since chiller compressor and CRAH/CRAC consumes huge amount of electricity. With proper design and deployment, the direct liquid cooling solution may be a cost-effective alternative to many existing data center cooling technologies under some circumstances. This work focus on the direct liquid cooling technology using cold plates in the cases of cooling high density processor chips and GPU accelerators. The current paper summaries two parts of work: an experimental testing work and a CFD modeling study. In the modeling study, different methodologies using a commercial available CFD package are developed. Several compact liquid cooling cold plate models are developed and validated against experimental data. The results show good agreement. In the experimental work, a single phase pumped liquid system test setup is developed in the lab, and it is used for liquid cooling tests. The test setup enables to adjust the fluid supply temperature and fluid mass flow rate to the designed test conditions. An electrical heater is used in the system to generate high fluid supply temperatures to the cold plate, such as 45°C or even higher. In the current work, a thermal mock-up chip and an actual GPU accelerator are used for characterizing the cold plate liquid cooling performance.