Ultrasonic additive manufacturing using feedstock with build-in circuitry for 3D metal embedded electronics
Ultrasonic additive manufacturing using feedstock with build-in circuitry for 3D metal embedded electronics
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DOI：
10.1016/j.addma.2019.100799
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发表时间：
2019-10-01
影响因子：
11
通讯作者：
Engstrom, Daniel S.
中科院分区：
文献类型：
--
作者：
Bournias-Varotsis, Alkaios;Han, Xiaoxiao;Engstrom, Daniel S.
嵌入式电子和传感器对于工业4.0的发展变得越来越重要。对于小型部件，空间限制导致只有通过增材制造才能实现完整的3D集成要求。制造金属部件通常需要与电子元件不兼容的高温，但超声波增材制造（UAM）可以生产机械性能接近体的部件，但内部嵌入电子元件，传感器或光学元件的集成。本文描述了一种在铝基体中嵌入三维通孔连接器的新型制造路线。带有印刷导体和绝缘体的金属箔与UAM工艺分开制备，从而将电子器件的制备与部件的固化分开。双材料聚合物层表现出最佳的电绝缘性能，同时为打印的有利轨道提供高达100摄氏度的机械保护。给出了金属基体中3D嵌入式电子器件的一般设计和UAM工艺建议。
Embedded electronics and sensors are becoming increasingly important for the development of Industry 4.0. For small components, space constraints lead to full 3D integration requirements that are only achievable through Additive Manufacturing. Manufacturing metal components usually require high temperatures incompatible with electronics but Ultrasonic Additive Manufacturing (UAM) can produce components with mechanical properties close to bulk, but with the integration of internal embedded electronics, sensors or optics. This paper describes a novel manufacturing route for embedding electronics with 3D via connectors in an aluminium matrix. Metal foils with printed conductors and insulators were prepared separately from the UAM process thereby separating the electronics preparation from the part consolidation. A dual material polymer layer exhibited the best electrically insulating properties, while providing mechanical protection of printed conducive tracks stable up to 100 degrees C. General design and UAM process recommendations are given for 3D embedded electronics in a metal matrix.