Hard X-ray imager (HXI) for the NeXT mission

Hard X-ray imager (HXI) for the NeXT mission
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用于 NeXT 任务的硬 X 射线成像仪 (HXI)

DOI:
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发表时间:
2006
期刊:
Astronomical Telescopes + Instrumentation
影响因子:
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通讯作者:
S. Nakahira
S. Nakahira
中科院分区:
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文献类型:
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作者:
M. Kokubun;K. Nakazawa;S. Watanabe;Y. Fukazawa;J. Kataoka;H. Katagiri;T. Mizuno;K. Makishima;M. Ohno;G. Sato;R. Sato;H. Tajima;Tadayuki Takahashi;T. Tamagawa;Takaaki Tanaka;M. Tashiro;H. Takahashi;Y. Terada;Y. Uchiyama;Y. Urata;K. Yamaoka;S. Takeda;T. Kishishita;M. Ushio;J. Katsuta;S. Ishikawa;H. Odaka;H. Aono;S. Sugimoto;Y. Koseki;T. Kitaguchi;T. Enoto;S. Yamada;T. Yuasa;Tsuyoshi Ueda;Y. Uehara;S. Okuyama;H. Yasuda;S. Nishino;Y. Umeki;Katsuhiro Hayashi;M. Matsuoka;Y. Ikejiri;A. Endo;Y. Yaji;N. Kodaka;W. Iwakiri;T. Kouzu;Takako Sugasawara;A. Harayama;S. Nakahira

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硬X射线成像仪(HXI)是计划于2013年发射的NeXT(新型探索X射线望远镜)任务中的三个焦平面探测器之一。它采用双面硅条探测器和碲化镉条探测器组成的混合结构,完全覆盖了硬X射线望远镜收集的光子能量范围,最高可达80 keV,具有很高的量子效率。通过低噪声前端 ASIC,可同时实现 400 微米间距的高空间分辨率和 1-2 keV (FWMH) 的能量分辨率。此外,厚厚的BGO主动屏蔽层紧凑地围绕着主要探测部分,继承了朱雀卫星上硬X射线探测器(HXD)的成功性能,能够实现极高的宇宙射线粒子背景和在轨激活的背景降低。总结了硬件开发的现状,包括关键技术的设计要求、预期性能和技术准备情况。
The Hard X-ray Imager (HXI) is one of three focal plane detectors on board the NeXT (New exploration X-ray Telescope) mission, which is scheduled to be launched in 2013. By use of the hybrid structure composed of double-sided silicon strip detectors and a cadmium telluride strip detector, it fully covers the energy range of photons collected with the hard X-ray telescope up to 80 keV with a high quantum efficiency. High spatial resolutions of 400 micron pitch and energy resolutions of 1-2 keV (FWMH) are at the same time achieved with low noise front-end ASICs. In addition, thick BGO active shields compactly surrounding the main detection part, as a heritage of the successful performance of the Hard X-ray Detector (HXD) on board Suzaku satellite, enable to achive an extremely high background reduction for the cosmic-ray particle background and in-orbit activation. The current status of hardware development including the design requirement, expected performance, and technical readinesses of key technologies are summarized.